Oerlikon Saurer with Innovations at the ITMA Asia 2010
30.07.2010
Oerlikon Saurer with Innovations at the ITMA Asia 2010 Arbon, 30. July 2010 – At the ITMA Asia 2010 in Shanghai, Oerlikon Saurer's latest innovations enticed countless visitors to their stand. The presentation of an innovative and extremely flexible thermal cutting device generated considerable interest among current and potential customers. Visitors were also greatly impressed by the quality, speed and reliability of the new double sequins device. We would like to extend warm thanks to all customers and potential customers who visited the Oerlikon Saurer stand. Please find attached further detailed information about the new cutting device and about our new double sequins system.